At their recent developer conference, Intel showed off some pretty neat stuff in terms of features we can expect to be incorporated in to Ultrabooks of the future. Top headlines all talked about the partnership with Nuance to offer voice search capabilities and control for 2013 books’, as well as Intel’s next line of Ultrabook specific processors named ‘Haswell’ which aim to increase the power efficiency in future machines.
Elsewhere at the conference, Intel was hard at work detailing a few other cool things surrounding next generation Ultrabooks, and looking back at my slides I came across a rather interesting one which details how thin major Ultrabook components need to be in order for manufacturers to build a machine which is just 15mm at its thinnest.
Imaged above, the slide details touch panel dimensions, battery dimensions, touch pad dimensions, keyboard dimensions and HDD dimensions. Titled ‘engineering challenges in going “Thinnest” and “Lightest”‘, the slide offers a rather unique insight in to what hurdles manufacturers have to overcome to create super light and thin machines.
Examples of super light machines include the NEC LaVie Z which, at just 875g, is the lightest 13.3″ Ultrabook on the planet (and lighter than any 11.6″ Ultrabook too). In terms of super thin, the Acer S5 measures in at 15mm thick at its thinnest whilst the Asus Zenbook more than that. Now if you have ever held or used either of those machines you will know that they are rake thin, highly portable and just about right for any normal human being.
Intel wants to go thinner though. If you check out the slide above, it details new types of keyboard and other components needed to break the 15mm barrier currently facing manufacturers.
The good news for the engineering departments of Ultrabook manufacturers is that Synaptics is currently creating a new keyboard for Ultrabooks which are 50% thinner than what is currently used, whilst Sharp is in talks with Intel to provide thinner LCD panels for machines.